- 目錄
第1篇 芯片后端設(shè)計(jì)工程師崗位職責(zé)
工作職責(zé)
負(fù)責(zé)asic/soc芯片的物理實(shí)現(xiàn)及推動(dòng)項(xiàng)目按時(shí)保質(zhì)完成,主要包括:主導(dǎo)floorplan,placement&routing,power planning,physical verification, top & block level timing closure; function and timing eco等方面的具體實(shí)現(xiàn)工作;負(fù)責(zé)與前端設(shè)計(jì)團(tuán)隊(duì)、foundry/design service/test&package/ip vendor的溝通,并推動(dòng)所有問(wèn)題按時(shí)解決;負(fù)責(zé)推動(dòng)項(xiàng)目的后端整體進(jìn)度,并順利投片。
工作要求
一本全日制本科或碩士畢業(yè),從事芯片物理設(shè)計(jì)3年以上, 熟悉rtl設(shè)計(jì)和驗(yàn)證基本流程;熟悉lint和cdc相關(guān)工具; 熟悉物理設(shè)計(jì)流程;具有豐富的頂層floorplan經(jīng)驗(yàn);具有豐富的placement&routing經(jīng)驗(yàn);具有l(wèi)ow power, dft, sta, em/ir-drop/si analysis, lec, physical verification, dfm等方面扎實(shí)的理論和實(shí)踐基礎(chǔ);具有28nm以下工藝節(jié)點(diǎn)流片經(jīng)驗(yàn)者優(yōu)先。
第2篇 數(shù)字后端設(shè)計(jì)工程師崗位職責(zé)
數(shù)字后端設(shè)計(jì)工程師 西安紫光國(guó)芯半導(dǎo)體有限公司 西安紫光國(guó)芯半導(dǎo)體有限公司,華芯半導(dǎo)體,西安紫光國(guó)芯,西安紫光國(guó)芯半導(dǎo)體有限公司,紫光國(guó)芯 asic backend design engineer (be)
數(shù)字后端設(shè)計(jì)工程師
responsibilities:
1. responsible for developing digital designs with emphasis on backend, including floor-plan, power planning, place, cts and route.
2. work with front-end designers to optimize timing/area/power of the design implementation and perform static timing analysis.
3. optimization and verification of layout for tape-out (including rc e_traction, eco, drc, lvs).
4. power ir drop analysis and optimization, area and parasitic layout optimization, chip size optimization.
5. static timing analysis (prime time) and setup/hold fi_.
6. formal verification for equivalence checking (formality).
7. generation of fill structures according to technology requirements.
requirements:
1. 4 years e_perience in backend design flow (apr) with proven soc tape-out e_perience.
2. e_perienced in synopsys/cadence automatically physical implementation tools and flows (ic-compiler/ astro / soc-encounter/ milky-way/ star-rc_) is a plus.
3. e_perience with one or more scripting languages (perl, tcl, or shell) to make reusable automatically flow is a plus.
4. e_perience and knowledge about fe design (rtl code, flow) and verification is a plus.
5. good analytical and debugging skills.
6. good command of english.
第3篇 后端設(shè)計(jì)師崗位職責(zé)
id后端實(shí)現(xiàn)設(shè)計(jì)師 oppo移動(dòng)通信 oppo廣東移動(dòng)通信有限公司,oppo,oppo手機(jī),oppo移動(dòng)通信,歐珀,歐珀移動(dòng)通信,oppo 職責(zé)描述:
1、在項(xiàng)目跟進(jìn)過(guò)程中對(duì)產(chǎn)品細(xì)節(jié)進(jìn)行嚴(yán)格管控,保證產(chǎn)品精致度。
2、與產(chǎn)品研發(fā)、技術(shù)制造等內(nèi)外部團(tuán)隊(duì)合作,及時(shí)溝通并解決項(xiàng)目不同階段產(chǎn)生的問(wèn)題,協(xié)助項(xiàng)目團(tuán)隊(duì)以確保項(xiàng)目進(jìn)度不延遲。
3、敢于創(chuàng)出新,能在項(xiàng)目跟進(jìn)過(guò)程中對(duì)方案的細(xì)節(jié)進(jìn)行再設(shè)計(jì),提升產(chǎn)品競(jìng)爭(zhēng)力。
4、負(fù)責(zé)項(xiàng)目簽樣工作。
任職要求:
1、本科及以上學(xué)歷。
2、有3年及3年以上的產(chǎn)品設(shè)計(jì)工作經(jīng)驗(yàn)者優(yōu)先。
3、具備優(yōu)秀的設(shè)計(jì)審美、時(shí)尚敏感度以及藝術(shù)鑒賞能力。
4、具有一定的創(chuàng)新意識(shí),敢于創(chuàng)新。
5、敏銳的洞察能力,對(duì)產(chǎn)品細(xì)節(jié)敏感,能及時(shí)發(fā)現(xiàn)問(wèn)題。
6、優(yōu)秀的手繪能力,精通設(shè)計(jì)軟件ai/coreldraw/photoshop和建模軟件rhino/proe/alias等。
7、優(yōu)秀的溝通表達(dá)能力和團(tuán)隊(duì)合作精神。
8、優(yōu)秀的邏輯分析能力,合理管控項(xiàng)目進(jìn)度。
第4篇 后端設(shè)計(jì)工程師崗位職責(zé)
ic后端設(shè)計(jì)工程師 南京華捷艾米 南京華捷艾米軟件科技有限公司,華捷艾米,南京華捷艾米,南京華捷艾米 responsibilities:
responsible for all aspects of chip backend design, including floor planning, place and routing, cts, timing convergence iterations/optimization, and final drc/lvs.
qualifications:
1. bsee, msee or higher.
2. at least 2 years e_perience of large asic backend designs.
3. e_perience with synopsys and/or cadence design tools.
4. have 65/40/28nm e_perience is better.
5. good communication skills, team spirit.
工作職責(zé):
負(fù)責(zé)整個(gè)芯片或模塊的布局布線(xiàn)設(shè)計(jì), 包括布局規(guī)劃, 布局布線(xiàn), 時(shí)鐘樹(shù)生成, 時(shí)序優(yōu)化和收斂, 以及 drc/lvs物理驗(yàn)證.
任職資格:
1. 電子工程或微電子專(zhuān)業(yè)本科及以上學(xué)歷;
2. 至少2年以上大規(guī)模集成電路芯片后端設(shè)計(jì)經(jīng)驗(yàn);
3. 具有使用synopsys 或cadence 設(shè)計(jì)工具的相關(guān)經(jīng)驗(yàn);
4. 最好有65/40/28nm設(shè)計(jì)經(jīng)驗(yàn);
5. 良好溝通能力和團(tuán)隊(duì)精神。
第5篇 ic后端設(shè)計(jì)工程師崗位職責(zé)
ic后端設(shè)計(jì)工程師 南京華捷艾米 南京華捷艾米軟件科技有限公司,華捷艾米,南京華捷艾米,南京華捷艾米 responsibilities:
responsible for all aspects of chip backend design, including floor planning, place and routing, cts, timing convergence iterations/optimization, and final drc/lvs.
qualifications:
1. bsee, msee or higher.
2. at least 2 years e_perience of large asic backend designs.
3. e_perience with synopsys and/or cadence design tools.
4. have 65/40/28nm e_perience is better.
5. good communication skills, team spirit.
工作職責(zé):
負(fù)責(zé)整個(gè)芯片或模塊的布局布線(xiàn)設(shè)計(jì), 包括布局規(guī)劃, 布局布線(xiàn), 時(shí)鐘樹(shù)生成, 時(shí)序優(yōu)化和收斂, 以及 drc/lvs物理驗(yàn)證.
任職資格:
1. 電子工程或微電子專(zhuān)業(yè)本科及以上學(xué)歷;
2. 至少2年以上大規(guī)模集成電路芯片后端設(shè)計(jì)經(jīng)驗(yàn);
3. 具有使用synopsys 或cadence 設(shè)計(jì)工具的相關(guān)經(jīng)驗(yàn);
4. 最好有65/40/28nm設(shè)計(jì)經(jīng)驗(yàn);
5. 良好溝通能力和團(tuán)隊(duì)精神。
